Wafer Fabrication

• Sub-micron wafer fabrication

• Thickness control to +/- 1.5 %

• Automated on-wafer probe test capabilities

• Class 100 Clean rooms

Assembly

• 33,000 dot per hour epoxy dispenser with .020 dot standard size

• Die or Component pick and place with 25,000 die or component per hour capability and 2 micron placement repeatability

• Deep Access Wire bond - Split-gap Weld, Solder Reflow, Seam Weld

• Nd:YAG lasers for active trimming of timing control products to 10 ps.

• Operators average over 10 years microwave assembly experience

• In-house certified IPC-A-610 Trainer

Testing

• Automated RF Testing to 40 GHz
• Active Laser Trim/Tune
• In-house Environmental Testing
  • Thermal Cycle
  • Acceleration
  • Automated Power Burn-in
  • Vibration

• Highly trained and experienced Microwave Test Personnel

• Dedicated Product Engineering responsible for Performance of Hardware